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Opinion: Chip scale packaged LEDs are far away from mass production

机译:观点:芯片级封装的LED距离批量生产还很遥远

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摘要

Chip scale packaging for LEDs was regarded as a revolution in the packaging industry two years ago. Recently, I was involved in a project related to chip scale packaging in the LED market. In the investigation I found that the mass production of chip scale packaging LEDs is not available anywhere in the world, even in China which is the biggest LED packaging market. This is because while production is technically possible the cost of single chip is much higher than the common surface mounted device/chip on board packages.
机译:两年前,LED的芯片级封装被视为封装行业的一场革命。最近,我参与了一个与LED市场中的芯片级封装相关的项目。在调查中,我发现,即使在最大的LED封装市场中国,也无法大规模生产芯片级封装的LED。这是因为虽然在技术上可以生产,但是单芯片的成本要比普通的表面安装设备/板上芯片封装高得多。

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  • 来源
    《Lighting Research & Technology》 |2017年第8期|932-932|共1页
  • 作者

    Ge Peng;

  • 作者单位

    Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Opto-electronics, South China University of Technology, Guangzhou, China;

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  • 正文语种 eng
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