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Research Note: LED chip-on-board packaging technology for strict colour tolerance

机译:研究注:LED板上芯片封装技术具有严格的色彩容限

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摘要

In the field of LED packaging, people usually pay more attention to colour temperature, luminous efficacy and colour rendering than colour tolerance. This paper focuses on how to meet strict colour tolerances in the process of chip-on-board packaging. The McAdam ellipses are used to explain the meaning of colour tolerance. A method based on adjusting the amount of phosphor glue and the proportions of different phosphors it contains is described. Measurements on samples packaged according to this method show that it makes it possible to meet strict colour tolerance requirements.
机译:在LED包装领域,人们通常比色差更关注色温,发光功效和显色性。本文着重介绍如何在板载芯片封装过程中满足严格的颜色公差。 McAdam椭圆用来解释颜色容差的含义。描述了一种基于调节磷光体胶水的量及其所包含的不同磷光体的比例的方法。根据此方法包装的样品的测量结果表明,它可以满足严格的颜色公差要求。

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  • 来源
    《Lighting Research & Technology》 |2017年第8期|1052-1057|共6页
  • 作者单位

    Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, South China University of Technology, Guangzhou, China;

    Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, South China University of Technology, Guangzhou, China;

    Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, South China University of Technology, Guangzhou, China;

    Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, South China University of Technology, Guangzhou, China,Department of Optoelectronic Engineering, Zhongshan Torch Polytechnic, Zhongshan, China;

    Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, South China University of Technology, Guangzhou, China;

    Guangzhou LEDteen Optoelectronics Co., Ltd, Guangzhou, China;

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