机译:研究注:LED板上芯片封装技术具有严格的色彩容限
Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, South China University of Technology, Guangzhou, China;
Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, South China University of Technology, Guangzhou, China;
Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, South China University of Technology, Guangzhou, China;
Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, South China University of Technology, Guangzhou, China,Department of Optoelectronic Engineering, Zhongshan Torch Polytechnic, Zhongshan, China;
Engineering Research Center for Optoelectronics of Guangdong Province, School of Physics and Optoelectronics, South China University of Technology, Guangzhou, China;
Guangzhou LEDteen Optoelectronics Co., Ltd, Guangzhou, China;
机译:高显色指数和高发光效率的LED板载芯片封装
机译:通过添加TiO 2 sub> /硅树脂封装层来增强板载封装LED的光学性能
机译:LED芯片封装基板的微轧制成型
机译:图案化基板对板上芯片封装LED的光提取效率的影响
机译:一项有效性和有效性研究,研究了电子家庭笔记干预套件,以提高任务和学习成绩。
机译:通过优化低熔点Sn-P-F-O玻璃基质实现高功率板载白光LED的黄变玻璃磷光体
机译:板载LED封装技术与优化