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Stress Field near Crack Close to Bonding interface in Explosion Clad Plate

机译:爆炸复合板结合界面附近裂纹附近的应力场

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Tensile tests are carried out using rectangular plate specimens extracted from the explosion clad plate. An artificial through-the-thickness edge crack or parallel cracks are made in each specimen. the cracks are close and perpendicular to the explosive interface. Stress field near cracks, stress intensity factor and crack opening displacement are examined by experiment as well as elasto-plastic finite element analysis. The stress field and stress intensity factor are evaluated by an infrared stress imaging system. The effects of the material inhomogeneity, residual stress, the change of material characteristics and the interaction of parallel cracks on the stress field, the stress intensity factor and the deformation behavior are revealed. The lower strength material ahead of the bonded interface increases the stress intensity factor and the crack opening displacement. The higher strength material allead of the bonded interface decreases the stress intensity factor and the crack opening displacement.
机译:使用从爆炸复合板中提取的矩形板样本进行拉伸试验。在每个样品中制作一个人造的全厚度边缘裂纹或平行裂纹。裂纹是紧密的并垂直于爆炸界面。通过实验以及弹塑性有限元分析来检查裂纹附近的应力场,应力强度因子和裂纹开口位移。通过红外应力成像系统评估应力场和应力强度因子。揭示了材料的不均匀性,残余应力,材料特性的变化以及平行裂纹的相互作用对应力场,应力强度因子和变形行为的影响。粘结界面之前的低强度材料会增加应力强度因子和裂纹开口位移。结合界面的较高强度的材料allead降低了应力强度因子和裂纹开口位移。

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