A Study on the New Method of Laser Scratch Testing Technique to Characterize Interfacial Adhesion Between Thin Film and Substrate

摘要

The interfacial adhesion between thin film and substrate are often the predominant factor in determining the performance and reliability of thin film-substrate system. A new method of laser scratch testing technique is presented to characterize the interfacial adhesion between film and substrate, which synthesizes the advantages of traditional scratching technique and laser measuring technique. The laser scratching mechanism is analyzed----thermal-stress spallation caused by the quasi-static heating of long pulse infrared laser and cold denudation of short pulse far-ultraviolet radiation laser, and the laser scratch equipment is introduced as well. Long pulse infrared laser scratch testing technique can be applied to detect thermal barrier film, such as hard tool film, decoration film, DLC film, function film and so on, while far-ultraviolet radiation laser scratch testing technique can be applied to detect macromolecule film and semiconductor material.