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Effect of Cutting Edge Truncation on Ground Surface Morphology of Hard and Brittle Materials for Optical Devices

机译:切削刃截断对光学器件硬质和脆性材料地面形貌的影响

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摘要

For the purpose of investigating the effect of cutting edge truncation on ground surface morphology, several kinds of hard and brittle materials used for optical devices, borosilicate glass, glass quartz, crystal quartz and sapphire, are plunge ground with a SD600 metal-bonded grinding wheel, the cutting edges of which are truncated so as to be aligned with the height level of the grinding wheel working surface, after electrocontact discharge truing and dressing. It is found that an improvement of roughness can be obtained for every material investigated, although the degree of roughness improvement depends on the kind of material. Ductile-mode grinding is most likely to be realized in the case of crystal quartz.
机译:为了研究切削刃截断对地面形貌的影响,用SD600金属粘结砂轮将几种用于光学设备的硬而脆的材料(硼硅酸盐玻璃,玻璃石英,水晶石英和蓝宝石)切入地面。在电接触放电修整和修整后,其切削刃被截去以便与砂轮工作表面的高度对齐。可以发现,尽管粗糙度的提高程度取决于材料的种类,但是对于所研究的每种材料都能获得粗糙度的提高。在晶体石英的情况下,最有可能实现延性模式研磨。

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