Crack Growth Mechanisms from 3-D Surface Flaw with Varied Dipping Angle Under Uniaxial Compression

摘要

A number of instability problems in rock engineering projects are caused by crack propagation. However, crack growth mechanisms from 3-dimentional flaw are not fully understood, in particular for 3-D flaw case with varied dipping angle. This study focuses on 3-D surface flaw using real rock specimens containing a flaw with varied inclination angle a from axial loading and dipping angle γ from specimen surface under uniaxial compression. Acoustic emission technique was used for tracing the initiation and growth of micro-cracks inside of specimen. It was found that crack growth process is affected by the dipping angle γ of the 3-D flaw. When dipping angle γ≠90°, the thickness of rock above the flaw plane is thinner than that of below the flaw plane. As a result, compressive crack and wing crack initiated easily from the thinner flaw tips. And, the normalized stress for crack initiation σ_i/σ_c, AE events and the AE energy for crack growth decreases with the dipping angle γ. However, for γ = 90°, the thickness of rock above and below of the flaw tips is the same, it was observed that anti-wing crack (crack growth direction opposite to wing crack) initiated first at a certain place away from the flaw tips, then wing crack and compressive crack emerged at the late stage. For this case, the stress σ_i/σ_c, AE events and the AE energy for crack initiation and propagation are at a high value. Thus, for rock mass contains flaws geometry with small dipping angle, some problems of crack propagation may be induced easily during excavation.