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Critical Cutting Condition for Brittle-Ductile Transition of KDP Crystals in Ultra-precision Machining

机译:KDP晶体在超精密加工中脆性-韧性转变的临界切削条件

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摘要

In this paper, mechanical characteristics of KDP crystal anisotropy are analysed theoretically. Vickers indentation experiments are adopted to validate the variation rule of hardness and fracture toughness in different orientation of KDP crystal plane (100), and a model to calculate critical cutting thickness of brittle-ductile transition is proposed for the KDP crystals. The result shows that, on the crystal plane (100), the minimum value of critical cutting thickness of KDP crystal in brittle-ductile transition appears in the direction [110], but the maximum appears in the direction [010]. Finally, the ultra-precision machining of KDP crystal is performed, and the results agree well with the theoretical conclusions. Super-smooth surface with a roughness RMS of 6.6nm is reached as machined in the crystal direction [010], and 11.2nm to the direction [110].
机译:本文从理论上分析了KDP晶体各向异性的力学特性。通过维氏压痕实验,验证了KDP晶面(100)在不同取向下硬度和断裂韧性的变化规律,并提出了一种计算KDP晶体脆性-延性转变临界切削厚度的模型。结果表明,在晶面(100)上,脆性-韧性转变过程中KDP晶体的临界切削厚度的最小值出现在[110]方向,而最大值出现在[010]方向。最后,对KDP晶体进行了超精密加工,其结果与理论结论相吻合。沿晶体方向[010]加工,粗糙度RMS为6.6nm的超光滑表面,沿方向[110]加工达到11.2nm的超光滑表面。

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