机译:临界未变形切屑厚度和切削压力与KDP晶体的延性模式切削有关
Department of Mechantronical Engineering and Automation,National University of Defense Technology, China Department of Mechanical Engineering, National University of Singapore, Singapore;
rnDepartment of Mechantronical Engineering and Automation,National University of Defense Technology, China Department of Mechanical Engineering, National University of Singapore, Singapore;
rnDepartment of Mechantronical Engineering and Automation,National University of Defense Technology, China;
rnDalian University of Science and Technology, China;
rnDepartment of Mechanical Engineering, National University of Singapore, Singapore;
KDP crystal; critical undeformed chip thickness; cutting pressure; ductile mode cutting;
机译:单晶硅切割中韧性模具瘢痕型临界未变形芯片厚度的预测
机译:KDP晶体在超精密加工中脆性-韧性转变的临界切削条件
机译:用于微铣削中切削力建模的通用瞬时未变形切屑厚度模型
机译:晶体KDP各向异性对超精密切割脆性韧性过渡临界病情影响的研究
机译:使用具有平行边界的新剪切区模型在稳态和动态正交金属切削中形成切屑的力学原理的通用方法,并验证了自动驾驶加工中的切削力预测。
机译:金刚石工具切削刃上的微缺陷影响KDP晶体的延性模式加工
机译:金刚石工具切削刃上的微缺陷,影响KDP晶体的延性模式加工
机译:单晶硅金刚石车削切削行为的韧脆转变