Review of Thermal Conductance Models for Joints Incorporating Enhancement Materials

摘要

A comprehensive review of analytical and empirical models for calculating the thermal conductance across mechanically formed joints is presented. A historical perspective of modeling procedures for a range of interface configurations is presented, including bare contacting surfaces for conforming rough surfaces as well as interfacial surfaces augmented with enhancement materials such as greases, metallic foils, polymeric compliant materials, films, and coatings. Given the wide range of interface materials available and their associated thermophysical and surface properties, the models presented provide an effective procedure for determining the significance of these properties in the prediction of contact, gap, and overall joint conductance.