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Conduction Shape Factor Models for Three-Dimensional Enclosures

机译:三维外壳的导电形状因子模型

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Analytical models are presented for conduction shape factors for three-dimensional regions formed between an isothermal, arbitrarily shaped body and its concentric, arbitrarily shaped surrounding enclosure. The model is based on the exact solution for the concentric spheres, and two methods are developed to predict the effective gap spacing. The models are validated using existing numerical data from the literature and data from simulations performed using a commercial computational fluid dynamics software package. The models are shown to be in excellent agreement with the data for all enclosures with geometrically similar boundary shape, within 3% rms. For enclosures formed between different boundary shapes, the models are shown to be accurate within 5% rms when the minimum aspect ratio, that is, the smallest outer boundary dimension over the largest inner dimension, is greater than 1.5.
机译:给出了在等温任意形状的物体与其同心任意形状的环绕外壳之间形成的三维区域的传导形状因子的分析模型。该模型基于同心球的精确解,并开发了两种方法来预测有效间隙间距。使用来自文献的现有数值数据和使用商业计算流体动力学软件包执行的模拟数据验证模型。所显示的模型与边界形状相似且均方根在3%以内的所有外壳的数据都非常吻合。对于在不同边界形状之间形成的外壳,当最​​小纵横比(即最小外部边界尺寸大于最大内部尺寸)大于1.5时,模型显示出5%rms的精确度。

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