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THERMAL STRESSES AROUND A CIRCULAR HOLE IN A FUNCTIONALLY GRADED PLATE

机译:功能梯度板上圆孔周围的热应力

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An exact thermal stress solution is provided for a functionally graded plate that has a circular hole, with the material properties and applied temperature varying arbitrarily in the radial direction. Building on an existing solution for homogeneous materials, an exact formulation for the functionally graded plate is established by generalizing the material constants and the two integration constants as variables and unknown functions of r, the radial coordinate. By solving a pair of first-order ordinary differential equations, the exact series expressions for the. two unknown functions are presented. Numerical results are furnished to demonstrate the numerical effectiveness and application potential of the formulation and the solution. Further extension is established to present an exact thermal stress solution for a composite, piecewise functionally graded plate with a circular hole.
机译:为具有圆形孔的功能梯度板提供了精确的热应力解决方案,其材料属性和施加的温度在径向方向上任意变化。在现有的均质材料解决方案的基础上,通过将材料常数和两个积分常数作为变量和径向坐标r的未知函数进行泛化,可以为功能梯度板建立精确的公式。通过求解一对一阶常微分方程,可得到精确的级数表达式。提出了两个未知的功能。提供了数值结果以证明该制剂和溶液的数值有效性和应用潜力。建立了进一步的扩展,以为具有圆形孔的复合,分段功能梯度板提供精确的热应力解决方案。

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