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A NEW MODEL OF FUNCTIONALLY GRADED COATINGS WITH A CRACK UNDER THERMAL LOADING

机译:热载荷作用下带有裂纹的功能梯度涂层的新模型

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摘要

A new model for fracture analysis oaf functionally graded materials (FGMs) with arbitrarily varying material properties under thermal loading is developed. The FGM is modeled as a multilayered medium and in each layer both shear modulus and thermal conductivity are assumed to be a linear function of the depth and are continuous on the subinterfaces. To make the crack problem tractable, thermal expansion and conductivity of the FGMs are supposed to have the same form. With this new model, the crack problem of a functionally graded coating bonded to a homogeneous substrate under steady-state thermal loading is investigated. Employment of the Fourier integral transform technique reduces the problem to a system of Cauchy singular integral equations that are solved numerically. Thermal stress intensity factors (TSIFs) are obtained for various forms of thermal conductivity or expansion. The results reveal that the present model is very efficient and in the frame of the present model both the form of thermal conductivity/expansion and that of its derivative can influence the TSIFs significantly.
机译:开发了一种在热载荷下具有任意变化的材料性能的功能梯度材料(FGM)断裂分析的新模型。 FGM被建模为多层介质,并且在每一层中,剪切模量和热导率均假定为深度的线性函数,并且在子界面上是连续的。为了使裂纹问题更容易处理,FGM的热膨胀和电导率应具有相同的形式。使用这种新模型,研究了在稳态热负荷下粘合到均质基材上的功能梯度涂层的裂纹问题。使用傅里叶积分变换技术将问题减少到一个用数​​值求解的柯西奇异积分方程组。对于各种形式的热导率或膨胀,可获得热应力强度因子(TSIF)。结果表明,本模型非常有效,并且在本模型的框架内,热导率/膨胀形式及其派生形式都可以显着影响TSIF。

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