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首页> 外文期刊>Journal of thermal stresses >THREE-DIMENSIONAL SEMI-ANALYTICAL THERMO-ELASTICITY SOLUTION FOR A FUNCTIONALLY GRADED SOLID AND AN ANNULAR CIRCULAR PLATE
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THREE-DIMENSIONAL SEMI-ANALYTICAL THERMO-ELASTICITY SOLUTION FOR A FUNCTIONALLY GRADED SOLID AND AN ANNULAR CIRCULAR PLATE

机译:功能梯度固体和环形圆板的三维半解析热弹性解

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摘要

Three-dimensional analysis of a functionally graded (FG) solid and an annular circular plate subjected to thermo-mechanical load with various boundary conditions are carried out in this paper. At first, the temperature gradient can he derived by solving the heat conduction equation exactly and then hy applying the differential quadrature method (DQM) along the radial direction and by using the state-space method in the thickness direction to the governing state equations results in a system of first-order differential equations, which can he solved analytically. The thermo-elastic constants of the plate are assumed to vary exponentially through the thickness, and the Poisson ratio is held to be constant. To verify the accuracy of the present work, a comparison is made with previously published results. The effects of temperature change, mechanical load, gradient index, edges conditions and thickness to radial length ratio on the behavior of the plate are examined.
机译:本文对功能梯度(FG)固体和在各种边界条件下承受热机械载荷的环形圆板进行了三维分析。首先,可以通过精确求解热传导方程,然后沿径向应用微分正交方法(DQM)并在厚度方向上使用状态空间方法对控制状态方程进行求解,得出温度梯度。一阶微分方程组,可以解析地求解。假定板的热弹性常数在厚度方向上呈指数变化,泊松比保持恒定。为了验证当前工作的准确性,将其与以前发布的结果进行了比较。研究了温度变化,机械载荷,梯度指数,边缘条件以及厚度与径向长度之比对板性能的影响。

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