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Coupled heat equation in thermoelasticity with temperature dependent moduli

机译:热弹性与温度相关的模量耦合热方程

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摘要

New and consistent expressions for the coupled heat equation are developed within the framework of small-strain thermoelasticity for both Fourier and Cattaneo-Vernotte conduction models. These expressions place no restrictions on the changes in temperature, allow for the temperature dependence of the thermoelastic moduli, and include all the coupling terms as functions of the thermoelastic moduli and their derivatives. As applications, (i) an extended Lord-Shulman-type model is derived that takes into account the temperature dependence of the thermoelastic moduli, and (ii) the equations underpinning the experimental technique of thermoelastic stress analysis are revisited.
机译:在傅里叶和Cattaneo-Vernotte传导模型的小应变热弹性框架内,开发了耦合热方程的新的一致表达式。这些表达式对温度的变化没有任何限制,允许热弹性模量与温度有关,并且包括所有耦合项作为热弹性模量及其衍生物的函数。作为应用,(i)导出了扩展的Lord-Shulman型模型,该模型考虑了热弹性模量的温度依赖性,并且(ii)重新研究了支持热弹性应力分析实验技术的方程式。

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