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Size-dependence of the dielectric breakdown strength from nano- to millimeter scale

机译:介电击穿强度的大小依赖性(从纳米到毫米)

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Dielectric breakdown decisively determines the reliability of nano- to centimeter sized electronic devices and components. Nevertheless, a systematic investigation of this phenomenon over the relevant lengths scales and materials classes is still missing. Here, the thickness and permittivity-dependence of the dielectric breakdown strength of insulating crystalline and polymer materials from the millimeter down to the nanometer scale is investigated. While the dependence of breakdown strength on permittivity was found to be thickness-independent for materials in the nm-mm range, the magnitude of the breakdown strength was found to change from a thickness-independent, intrinsic regime, to a thickness-dependent, extrinsic regime. The transition-thickness is interpreted as the characteristic length of a breakdown-initiating conducting filament. The results are in agreement with a model, where the dielectric breakdown strength is defined in terms of breakdown toughness and length of a conducting filament.
机译:介电击穿决定性地决定了纳米到厘米大小的电子设备和组件的可靠性。但是,仍然缺少对有关长度范围和材料类别的这种现象的系统研究。在此,研究了绝缘的晶体和聚合物材料从毫米到纳米尺度的厚度和介电击穿强度的介电常数依赖性。尽管发现击穿强度对介电常数的依赖性与厚度在nm-mm范围内的材料无关,但发现击穿强度的大小从与厚度无关的本征态变为与厚度无关的本征态政权。转变厚度被解释为引发击穿的导电丝的特征长度。结果与模型一致,在模型中,击穿强度是根据击穿韧性和导电丝的长度来定义的。

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