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Tuning Thermal Expansion in Metal-Organic Frameworks Using a Mixed Linker Solid Solution Approach

机译:使用混合接头固溶体方法调节金属有机框架中的热膨胀

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Several metal-organic frameworks are known to display negative thermal expansion (NTE). However, unlike traditional NTE material classes, there have been no reports where the thermal expansion of a MOF has been tuned continuously from negative to positive through the formation of single-phase solid solutions. In the system Zn-DMOF-TMx, Zn-2[(bdc)(2-2x)(TM-bdabco)(2x)][dabco], the introduction of increasing amounts of TM-bdc, with four methyl groups decorating the benzene dicarboxylate linker, leads to a smooth transition from negative to positive thermal expansion in the a-b plane of this tetragonal material. The temperature at which zero thermal expansion occurs evolves from similar to 186 K for the Zn-DMOF parent structure (x = 0) to similar to 325 K for Zn-DMOF-TM (x = 1.0). The formation of mixed linker solid solutions is likely a general strategy for the control of thermal expansion in MOFs.
机译:已知几种金属有机框架显示负热膨胀(NTE)。但是,与传统的NTE材料类别不同,目前还没有关于通过形成单相固溶体将MOF的热膨胀连续从负调节到正的报道。在系统Zn-DMOF-TMx,Zn-2 [((bdc)(2-2x)(TM-bdabco)(2x)] [dabco]中,引入了数量不断增加的TM-bdc,其中四个甲基装饰了苯二羧酸酯连接基导致该四方材料的ab平面从负热膨胀平稳过渡到正热膨胀。发生零热膨胀的温度从Zn-DMOF母体结构的186 K(x = 0)演变为Zn-DMOF-TM的325 K(x = 1.0)。混合接头固溶体的形成可能是控制MOF热膨胀的一般策略。

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