超臨界二酸化炭素による金属錯体注入と銅めっき密着性評価: 液晶ポリマープリント基板

摘要

プリント基板（PCB）は，あらゆる電子部品を支えてい る重要な受動部品の一つであり，市場からの要求は高密 度・高信頼性回路形成への更なる技術対応である［1，2］． 　携帯電話やパーソナルコンピュータの普及と高性能化 に伴い，これらの電子機器の軽量化，薄型化，小型化対 応と電気特性の改善が求められている．現状では，紙／フェ ノール，ガラス／エポキシ，ガラス／ポリイミド樹脂等が主 な基板材料であるが，高度な電気特性と信頼性及び環境 対策に対応するためには新たな材料の適用が必要不可欠 となっている．%To preparing the printed circuit boards (PCB's) much more high speed processes are required keeping high quality of electrical properties. High reliability and guaranteed quality are also important. The latest PCB's are shifting into more fine line circuitry, high density and narrow space conductor lines. Recently, PCB's materials change from epoxy type to liquid crystalline polymer (LCP) type. An essential subject for this technology is to improve the weak copper adhesive peel strength on LCP insulation materials. To get the good adhesion property of copper plating, it is now widely applying Pd colloid solution method. To achieve more excellent adhesion for next decade generation PCB's, we are investigating supercritical fluid (SCF) method. In this paper, an attempt has been done to impregnate some metal complexes into LCP material and decomposed them to produce free metal in the resin by reduction. Using the deposited metal an efficient electro-less Cu plating is achieved. We will discuss on the selection of the metal complexes and impregnation condition of the complexes as well as peel strength of the plating.