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Evaluation of Sharp Indentation Testing of Thin Films and Ribbons on Hard Substrates

机译:硬质基材上的薄膜和色带的尖锐压痕测试的评估

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A numerical investigation of sharp indentation of thin films and ribbons has been conducted using the finite element method. For a wide variety of material behavior, the critical ratio of indentation depth to thin film thickness is determined for the case of indentation of thin films or ribbons perfectly clamped on hard substrates. The critical ratio is defined as the ratio at which the indentation response can no longer be considered closely acceptable to the corresponding response at indentation of bulk materials. The indentation parameters investigated are hardness (average contact pressure), the size of the contact area between indenter and material, and the initial unloading slope of the indentation load-indentation depth curve. The implications of the results for material characterization of thin films and ribbons by indentation are discussed in some detail.
机译:使用有限元方法对薄膜和色带的尖锐压痕进行了数值研究。对于各种各样的材料行为,对于完全夹持在硬质基材上的薄膜或带的压痕情况,应确定压痕深度与薄膜厚度的临界比。临界比被定义为这样的比率,在该比率下,不再认为压痕响应与散装材料压痕处的相应响应紧密接近。研究的压痕参数是硬度(平均接触压力),压头与材料之间的接触区域的大小以及压痕载荷-压痕深度曲线的初始卸载斜率。详细讨论了结果对通过压痕对薄膜和带材进行材料表征的含义。

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