Abrasive properties of nano silica particles prepared by a sol–gel method for polishing silicon wafers

摘要

Abrasive properties of cocoon shaped silica particles fabricated by a sol–gel method have been studied. Since silicon wafers are polished with slurry by the mechanism of Chemical Mechanical Polishing, polishing rates may depend on various chemical and mechanical factors, such as particle concentration in slurry, slurry pH and kinds of basic compounds for controlling the slurry pH.