The evolution of interface structure in TLP bonded joints of Al2</sub>O3p</sub>/6061Al composites with Cu/Ni/Cu interlayers

Yan Jiuchun; Xu Zhiwu; Wu Gaohui; Yang Shiqin

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The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers

机译：具有Cu / Ni / Cu中间层的Al2 O3p / 6061Al复合材料的TLP键合接头界面结构的演变

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来源
《Journal of Materials Science》 |2005年第19期|5307-5309|共3页
作者
Yan Jiuchun; Xu Zhiwu; Wu Gaohui; Yang Shiqin;
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作者单位

State Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology;

State Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology;

State Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology;

State Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology;

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1. Interface structure and mechanical performance of TLP bonded joints of Al_2O_3p/6061Al composites using Cu/Ni composite interlayers [J] . Jiuchun Yan, Zhiwu Xu, Gaohui Wu, Scripta materialia . 2004,第2期

机译：Cu / Ni复合中间层的Al_2O_3p / 6061Al复合材料TLP粘结接头的界面结构和力学性能
2. Interfacial Microstructure and Mechanical Strength of Ferritic Stainless Steel and Silicated Graphite Joints Bonded with Cu/Ni Composite Interlayers [J] . C. J. Chun, H. C. Yong, Z. J. Song Scripta materialia . 2006,第4期

机译：Cu / Ni复合中间层粘结的铁素体不锈钢和硅化石墨接头的界面组织和机械强度
3. Microstructure evolution and mechanical properties of titanium matrix composites and Ni-based superalloy joints with Cu interlayer [J] . Gao Yanan, Huang Lujun, An Qi, Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2018,第期

机译：钛基复合材料的微观结构演化与Cu interlayer基于Ni基超合金接头的力学性能
4. Reliability of Laminated Bond Structure Using (Cu, Ni)/Sn TLP Bonding with Al Interlayer for High Temperature Power Electronics Packaging [C] . Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede IEEE Electronic Components and Technology Conference . 2019

机译：（Cu，Ni）/ Sn TLP键合铝中间层的叠层键合结构在高温电力电子封装中的可靠性
5. Engineering and investigation of the interlayer exchange coupling in bcc Fe/Cu/Fe(001) structures. [D] . Kowalewski, Maciej Matthew Zbigniew. 1998

机译：bcc Fe / Cu / Fe（001）结构中层间交换耦合的工程研究。
6. Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu [O] . Jing-Ye Juang, Chia-Ling Lu, Yu-Jin Li, 2018

机译：（111）定向和纳米孪晶铜的结合界面微观结构与铜-铜接头的剪切强度之间的相关性
7. Interface characteristics of Al2O3-TiC/Cr18-Ni8 diffusion-bonded joint using a Ti/Cu/Ti multi-interlayer (LETTER TO THE EDITOR) [O] . W. HUANG, Y. LI, J. WANG, 2010

机译：使用Ti / Cu / Ti多层间的Al2O3-TiC / Cr18-Ni8扩散键合关节的界面特性（信件到编辑器）

The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers

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