机译:Co的添加对Sn–3.0 Ag–0.5 Cu基焊点电迁移行为的影响
The College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, People’s Republic of China;
The College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, People’s Republic of China;
The College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, People’s Republic of China;
The College of Materials Science and Engineering, Beijing University of Technology, Beijing, 100124, People’s Republic of China;
State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing, 100083, People’s Republic of China;
机译:Co的添加对Sn-3.0 Ag-0.5 Cu基焊点电迁移行为的影响
机译:高电流密度下Sn-37Pb和Sn-3.0Ag-0.5Cu倒装芯片焊点的电迁移行为
机译:高电流密度下Sn-37Pb和Sn-3.0Ag-0.5Cu倒装芯片焊点中的电迁移行为
机译:电迁移到焊点形成的影响:99.3sn-0.7cu和96.5sn-3.0ag-0.5cu无铅焊料之间的比较
机译:静态和动态时效对Sn3.0Ag0.5Cu钎料合金疲劳行为的影响
机译:Cu / Sn-3.0AG-0.5Cu / Cu / Cu / Cu / Cu焊点在电迁移期间锯齿状阴极溶解的结晶特征效应
机译:电迁移对焊点形成的影响:99.3sn-0.7Cu与96.5sn-3.0ag-0.5Cu无铅焊料的比较