Effects of 0.1 wt% Ni addition and rapid solidification process on Sn-9Zn solder

摘要

Effects of 0.1 wt% Ni addition and rapid solidification process on Sn-9Zn solder alloy were investigated. Characteristics of Sn-9Zn-0.1Ni alloy were analyzed compared with those of as-solidified Sn-9Zn alloy. Mechanical properties and interfacial microstructure of solder/Cu joints obtained using these solders were comparatively studied. By comparison with as-solidified Sn-9Zn alloy, the wettability of solder was obviously improved with 0.1 wt% Ni addition, and the melting behavior of the solder was promoted due to the rapid solidification process. The corrosion resistance of as-solidified and rapidly solidified Sn-9Zn-0.1Ni alloys was improved due to the formation of Ni-Zn intermetallic compound (IMC) and the refining of Zn-rich phases. Formation and growth of IMCs at the interface of Sn-9Zn-0.1Ni/Cu joints was significantly depressed. Rapid solidification process promoted the interfacial reaction during soldering and improved the bonding strength of joints.