Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition

摘要

The aim of this study is to evaluate the corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy under high-temperature and high-humidity condition. The corrosion of SAC305 alloy was attributed to the oxidation of Sn, which formed SnO_2 and SnO, and SnO_2 existed on the outer layer of the oxide film. After a period exposure, a stable and dense protective oxide film formed on the specimen surfaces, and the specimen which exposed at 75 ℃ had the thickset oxide film.