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Conductivity improvement of silver flakes filled electrical conductive adhesives via introducing silver-graphene nanocomposites

机译:通过引入银-石墨烯纳米复合材料提高填充银薄片的导电胶的导电性

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摘要

In this study, silver-graphene nanocomposites (SGNs) were successfully prepared by spontaneous reduction of silver ions and graphene oxide. Silver nano-particles (about 30 nm) with narrow size distribution were distributed randomly on the surface of graphene. Different amounts of SGNs were introduced into silver flakes filled electrical conductive adhesives (ECAs) to study the effect of SGNs on the properties of the ECAs. The results showed that the volume resistivity of the ECAs decreased first and then increased with the increase of weight ratios of SGNs to silver flakes. While the weight ratio of SGNs to silver flakes was 20:80 (%), the resistivity reached the lowest value of 2.37 × 10~(-4) Ω cm. The lap shear strength decreased with the increase of the content ration of SGNs. And when the weight ratio of SGNs to silver flakes was 20:80 (%), the lap shear strength of ECA was about 10 MPa. According to the thermogravimetric analysis, the addition of SGNs can cause a slight decrease in the thermal stability of the ECA. In summary, SGNs are the promising candidates for the conductivity improvement of silver flakes filled electrical conductive adhesives.
机译:在这项研究中,通过自发还原银离子和氧化石墨烯成功地制备了银-石墨烯纳米复合材料(SGNs)。具有窄尺寸分布的银纳米粒子(约30 nm)随机分布在石墨烯表面。将不同量的SGNs引入填充有鳞片的导电胶(ECA)中,以研究SGNs对ECA性能的影响。结果表明,随着SGNs与银片的重量比增加,ECA的体积电阻率先下降,然后上升。当SGN与银薄片的重量比为20:80(%)时,电阻率达到最低值2.37×10〜(-4)Ωcm。随SGNs含量的增加,搭接剪切强度降低。当SGN与银薄片的重量比为20:80(%)时,ECA的搭接剪切强度约为10 MPa。根据热重分析,添加SGN会导致ECA的热稳定性略有下降。总而言之,SGNs是改善银薄片填充的导电胶的导电性的有希望的候选者。

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  • 来源
    《Journal of materials science》 |2014年第3期|1149-1155|共7页
  • 作者单位

    State Key Laboratory of Plastic Forming Simulation and Die and Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, Hubei, People's Republic of China;

    State Key Laboratory of Plastic Forming Simulation and Die and Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, Hubei, People's Republic of China;

    State Key Laboratory of Plastic Forming Simulation and Die and Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, Hubei, People's Republic of China;

    State Key Laboratory of Plastic Forming Simulation and Die and Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, Hubei, People's Republic of China;

    State Key Laboratory of Plastic Forming Simulation and Die and Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, Hubei, People's Republic of China;

    Nanomaterials Research Center, Nanchang Institute of Technology, Nanchang 330013, Jiangxi, People's Republic of China;

    State Key Laboratory of Plastic Forming Simulation and Die and Mold Technology, Huazhong University of Science and Technology, Wuhan 430074, Hubei, People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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