机译:利用破坏性和非破坏性技术研究低温阳极键合的效果及其在MEMS封装中的可靠性
Nanomaterials and Devices Research Laboratory, School of Nano Science and Technology, NIT,Sensors and Nanotechnology Group, CSIR-Central Electronics Engineering Research Institute;
Department of ECE, Viswajyothi College of Engineering and Technology;
Nanomaterials and Devices Research Laboratory, School of Nano Science and Technology, NIT;
Sensors and Nanotechnology Group, CSIR-Central Electronics Engineering Research Institute;
Sensors and Nanotechnology Group, CSIR-Central Electronics Engineering Research Institute;
Nanomaterials and Devices Research Laboratory, School of Nano Science and Technology, NIT;
Sensors and Nanotechnology Group, CSIR-Central Electronics Engineering Research Institute;
机译:粗铝线的可靠性:使用非破坏性方法研究引线键合参数对热循环降解速率的影响
机译:阳极键合晶圆级气密MEMS封装及其可靠性问题
机译:用于评估高频有源器件可靠性的非破坏性技术
机译:MEMS晶圆级包装应用的阳极键合的研究
机译:使用各种非破坏性技术研究混凝土中的硅烷处理方法。
机译:用非破坏性技术表征具有开放孔的航空复合材料的实验和数值研究
机译:粗铝线的可靠性:使用非破坏性方法研究引线键合参数对热循环降解速率的影响
机译:晶圆级封装微机电系统(mEms)加速开关的非破坏性阻尼测量。