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Structural characterization of highly textured A1N thin films grown on titanium

机译:钛上生长的高织构AlN薄膜的结构表征

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摘要

A pulsed direct current (dc) reactive ion beam sputtering system has been used to synthesize highly c-axis oriented aluminum nitride (AlN) thin films on (0002)-oriented 200-nm thin titanium layers deposited on a Si-(111) substrate. After a systematic study of the processing variables, high-quality polycrystalline films with preferred c-axis orientation have been grown successfully on the Ti (0002) layer using an Al target under a N2/(N2 + Ar) ratio of 70%, a 2 mTorr processing pressure, and keeping the temperature of the substrate holder at ambient temperature (no substrate heating). The crystalline quality of the A1N and the underlaying Ti thin films was characterized by high-resolution x-ray diffraction. Best ω full width at half maximum values of the (0002) reflection for 1 -μm thin A1N layers are 0.56°. Hence, the A1N layers show a high degree of orientation in the (0002) direction, which directly translates into a high Q value piezoelectric response. Atomic force microscopy measurements were used to study the surface morphology of the Ti layer in an attempt to understand its impact on the quality of the A1N films deposited on top of them. Transmission electron microscopy cross-section analysis has been carried out to investigate the AlN/Ti interface. Our observations reveal the presence of crack-free layers with a smooth surface and extremely low defect density. Even local epitaxy phenomena have been identified at the AlN/Ti interface. The processing conditions used to synthesize A1N layers on Ti at room temperature are efficient in reducing the dislocation density and in-plane residual strain. Such AlN/Ti bilayers can be applied to manufacture novel electroacoustic device structures (such as bulk acoustic wave filters) on silicon substrates in further investigations.
机译:已使用脉冲直流(dc)反应离子束溅射系统在沉积在Si-(111)衬底上的(0002)取向的200 nm薄钛层上合成高度c轴取向的氮化铝(AlN)薄膜。在对工艺变量进行系统研究之后,使用Al靶材在N2 /(N2 + Ar)比率为70%的条件下,成功地在Ti(0002)层上成功生长了具有优选c轴取向的高质量多晶膜。 2 mTorr的处理压力,并将基板支架的温度保持在室温(不加热基板)。 AlN和底层Ti薄膜的晶体质量通过高分辨率x射线衍射表征。 1-μm薄AlN层的(0002)反射一半最大值的最佳ω全宽度为0.56°。因此,AlN层在(0002)方向上显示出高取向度,这直接转化为高Q值压电响应。为了了解钛层对沉积在其上的AlN薄膜质量的影响,人们使用了原子力显微镜测量技术来研究Ti层的表面形态。已经进行了透射电子显微镜截面分析以研究AlN / Ti界面。我们的观察结果表明存在表面光滑且缺陷密度极低的无裂纹层。甚至在AlN / Ti界面也发现了局部外延现象。在室温下用于在Ti上合成AlN层的加工条件可有效降低位错密度和面内残余应变。这种AlN / Ti双层可用于在进一步研究中在硅基板上制造新型电声器件结构(例如体声波滤波器)。

著录项

  • 来源
    《Journal of Materials Research 》 |2010年第3期| 458-463| 共6页
  • 作者

    Gonzalo F. Iriarte;

  • 作者单位

    Instituto de Sistemas Optoelectronicos y Microtecnologia (ISOM)-Universidad Politecnica de Madrid, Ciudad Universitaria s, E-28040 Madrid, Spain;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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