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首页> 外文期刊>Journal of Manufacturing Processes >In situ X-ray tomography investigations on laser welding of copper with 515 and 1030 nm laser beam sources
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In situ X-ray tomography investigations on laser welding of copper with 515 and 1030 nm laser beam sources

机译:原位X射线断层扫描对铜激光焊接的调查,具有515和1030 nm激光束源

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摘要

A paramount challenge in laser micro welding is to design welding processes both highly energy efficient and precise regarding weld depth and surface roughness. With society's increasing interest in alternative energy storage systems, the demand for copper connections increases and processes for contacting electronic components for batteries and fuel cells are gaining in importance. Fiber lasers with a wavelength in the near infrared range have established themselves for this purpose [1,2]. However, the high thermal conductivity and low energy absorption of infrared radiation of copper cause significant difficulties such as pore and spatter formation. An increase in absorption of the electromagnetic radiation from 5 % (1030 nm) to 55 % (515 nm) of copper at room temperature, leads to a higher energy input into the material during the process which promotes lasers in the visible wavelength range as a more efficient alternative to near infrared lasers [3]. In this work, we investigate in situ X-ray tomography experiments during laser beam welding of copper with 515 nm and 1030 nm laser beam sources. Both lasers are equipped with similar optical setups to achieve identical focal diameters on the material surface. We investigate the difference in the geometric shape of the keyholes during the process. A wide range of laser parameters is investigated to create a basis for comparison with our numerical keyhole model [4]. It is found, that a significant difference in the depth of the keyhole depending on the wavelength occurs. A higher sensitivity to the variation of feed rate and laser power is observed for the 1030 nm laser source than for the 515 nm laser source.
机译:激光微焊接中的最重要的挑战是设计焊接工艺,这对于焊接深度和表面粗糙度的高度能量效率和精确。随着社会对替代能量存储系统的兴趣日益增长的兴趣,对电池和燃料电池的电子元件接触的对铜连接的需求增加和过程的重要性。为此目的建立了近红外范围波长的光纤激光器[1,2]。然而,铜的红外辐射的高导热率和低能量吸收会导致孔隙和喷溅的显着困难。在室温下,在室温下铜的5%(1030nm)至55%(515nm)的电磁辐射的吸收增加导致在促进可见波长范围内的激光器的过程中输入材料的更高能量。更高效的近红外激光器替代方案[3]。在这项工作中,我们在具有515nm和1030nm激光束源的铜的激光束焊接期间研究了原位X射线断层摄影实验。两个激光器都配备了类似的光学设置,以在材料表面上实现相同的焦距直径。我们研究了过程中钥匙孔的几何形状的差异。研究了广泛的激光参数,为与我们的数值钥匙孔模型进行比较,以创建基础[4]。找到,根据波长的锁孔深度的深度差异。对于515nm激光源的1030nm激光源观察到对进料速率和激光功率变化的更高敏感性。

著录项

  • 来源
    《Journal of Manufacturing Processes》 |2021年第7期|170-176|共7页
  • 作者单位

    Rhein Westfal TH Aachen Chair Laser Technol LLT Steinbachstr 15 D-52074 Aachen Germany;

    Rhein Westfal TH Aachen Chair Laser Technol LLT Steinbachstr 15 D-52074 Aachen Germany;

    Rhein Westfal TH Aachen Nonlinear Dynam Laser Proc NLD Steinbachstr 15 D-52074 Aachen Germany;

    Rhein Westfal TH Aachen Nonlinear Dynam Laser Proc NLD Steinbachstr 15 D-52074 Aachen Germany;

    Rhein Westfal TH Aachen Chair Laser Technol LLT Steinbachstr 15 D-52074 Aachen Germany|Fraunho Inst Laser Technol ILT Steinbachstr 15 D-52074 Aachen Germany;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Laser welding; X-ray; Tomography; 515 nm; 1030 nm; Copper;

    机译:激光焊接;X射线;断层扫描;515 nm;1030 nm;铜;

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