首页> 外文期刊>Journal of Manufacturing Processes >The role of TLP process variables in improvement of microstructure and mechanical properties in TLP joints of GTD-111/Ni-Cr-Fe-B-Si/GTD-111 system
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The role of TLP process variables in improvement of microstructure and mechanical properties in TLP joints of GTD-111/Ni-Cr-Fe-B-Si/GTD-111 system

机译:TLP工艺变量在改善GTD-111 / Ni-Cr-Fe-B-Si / GTD-111系统的TLP接头的组织和力学性能中的作用

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摘要

In this research microstructure and mechanical properties of the transient liquid phase (TLP) joint of GTD-111 superalloy using Ni-7.6Cr-3.4Fe-3.6Si-3B amorphous interlayer were investigated. The effect of joining parameters such as temperature, time and interlayer thickness on the microstructure and mechanical properties of the joint was studied. The results showed that eutectic and intermetallic compounds e.g. nickel-rich and chromium-rich borides, Ni-Si-B compound and eutectic-gamma form continuously in the joint region during cooling. The thickness and continuity of the intermetallic phases decreased with increasing joining time. Moreover, increasing joining temperature to 1180 degrees C led to the elimination of intermetallic phases. The phases were reappeared as the joining temperature was further increased up to 1200 degrees C. In addition, increasing the interlayer thickness led to a thicker eutectic structure in the joint region. Shear strength of the joints increased with increasing holding time. Increasing the bonding temperature led to an increase in shear strength (except 1200 degrees C) which was in agreement with hardness variation. Furthermore, it was shown that homogenization of the samples after the joining process led to a more uniform hardness profile in the joint and significant increase in the shear strength up to 97% of the base metal strength. According to the obtained results the optimum time, temperature, and interlayer thickness for the TLP bonding of GTD-111 are 105 min, 1120 degrees C and 25 mu m, respectively.
机译:在这项研究中,研究了使用Ni-7.6Cr-3.4Fe-3.6Si-3B非晶夹层的GTD-111高温合金的瞬时液相(TLP)接头的组织和力学性能。研究了诸如温度,时间和中间层厚度等连接参数对接头组织和力学性能的影响。结果表明,共晶和金属间化合物例如。在冷却过程中,富镍和富铬的硼化物,Ni-Si-B化合物和低共熔γ在连接区域连续形成。金属间相的厚度和连续性随连接时间的增加而减小。此外,将接合温度提高到1180摄氏度导致消除了金属间相。随着接合温度进一步升高至1200℃,相再次出现。另外,增加层间厚度导致接合区域中的较共晶结构更厚。关节的剪切强度随着保持时间的增加而增加。粘合温度的升高导致抗剪强度的增加(1200℃除外),这与硬度变化是一致的。此外,结果表明,在接合过程之后,样品的均质化导致接合处的硬度分布更加均匀,并且剪切强度显着提高,达到母材强度的97%。根据获得的结果,GTD-111进行TLP粘合的最佳时间,温度和中间层厚度分别为105分钟,1120摄氏度和25微米。

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