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Effect of Bonding Temperature on Microstructure and Mechanical Properties during TLP Bonding of GH4169 Superalloy

机译：GH4169超合金中TLP键合过程中粘合温度对微观结构和机械性能的影响

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Qing He; Dongdong Zhu; Duo Dong; Mengjia Xu; Anpeng Wang; Qiancheng Sun;
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1. Pre- and post-TLP bond solution treatments: Effects on the microstructure and mechanical properties of GTD-111 superalloy [J] . Amiri Danesh, Sajjadi Seyed Abdolkarim, Kamyabi-Gol Ata Journal of Manufacturing Processes . 2020,第Sepa期

机译：TLP后和TLP后粘合溶液处理：对GTD-111超合金的微观结构和机械性能的影响
2. Effect of post-bond heat treatment on microstructure and mechanical properties of the wide gap TLP bonded IC10 superalloy with a low boron Ni_3Al-based interlayer [J] . Yue Xiong, Liu Fengmei, Li Qi, Journal of Manufacturing Processes . 2020,第Juna期

机译：粘合后热处理对低硼Ni_3Al interlayer的宽间隙TLP粘结IC10超合金组织和力学性能的影响
3. Effect of bonding time and homogenization heat treatment on the microstructure and mechanical properties of the transient liquid phase bonded dissimilar GTD-111/FSX-414 TLP superalloys [J] . Hadibeyk S., Beidokhti B., Sajjadi S. A. Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2018,第期

机译：粘合时间和均质化热处理对瞬态液相粘结微观结构和力学性能的影响效应和机械性能兼容多样化GTD-111 / FSX-414 TLP高温合金
4. Microstructure and mechanical property of GH4169 joints by vacuum diffusion bonding [C] . Zhuoran Li, Bing Liu, Xianglong Zhang, International Conference on Advanced Design and Manufacturing Engineering . 2011

机译：真空扩散粘合GH4169关节的微观结构和力学性能
5. The effects of bonding parameters on isothermal solidification rate and microstructure of TLP bonded in 738LC superalloy. [D] . Idowu, Oluwaseun Ayodeji. 2005

机译：键合参数对738LC高温合金中TLP键合的等温凝固速率和组织的影响。
6. Effect of Turning Amount on Metallurgical Qualities and Mechanical Properties of GH4169 Superalloy [O] . Jinglong Qu, Shufeng Yang, Zhengyang Chen, 2019

机译：车削量对GH4169合金冶金质量和力学性能的影响。
7. Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni3Al based Superalloy IC10 [O] . Xiong Yue, Fengmei Liu, Hexing Chen, 2018

机译：基于Ni3Al超合金IC10的TLP键合过程中粘合温度对微观结构演化的影响

Effect of Bonding Temperature on Microstructure and Mechanical Properties during TLP Bonding of GH4169 Superalloy

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