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Investigation on formability of bipolar plates during flexible micro forming of Cu/Ni clad foils

机译:Cu / Ni复合箔柔性微成形过程中双极板成形性研究

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摘要

The formability of metal micro-parts is difficult to predict by the traditional theories because of the size effects induced by the interactive effects of specimen intrinsic and extrinsic characteristics with miniaturization. In this study, the interactive effects of different parameters on the forming quality of micro channel by flexible forming were conducted. The forming characteristic of Cu/Ni clad foils was studied from the microstructure and stress-strain state. Experimental results show that the forming depth, the irregular deformation and surface roughness increased when the annealing temperature was elevated. Due to the reduction of the micro channel feature size (cavity width), the relative forming depth and surface roughness value decreased, the located thickness thinning became serious. The surface roughness of formed part was related to plastic deformation degree, grain size and the surface quality of micro-die. And the effect of stacking sequence on forming results related to the grain sizes and the feature sizes for Cu/Ni clad foils. The formability was generally better when the Cu layer located outside. However, when the feature size reduced and grain size of Ni layer was fine and uniform, the forming quality when the Ni layer located outside was improved, even exceeded the other resulted. The difference of stress-strain states between during forming bipolar plate and forming micro channel was analyzed. Several parameters such as forming load, lubrication mode and holding time were optimized, and the bipolar plates were fabricated and evaluated by the optimized parameters.
机译:金属微型零件的可成形性很难用传统理论来预测,这是由于试样内在和外在特性与小型化的相互作用所引起的尺寸效应。本文研究了不同参数对柔性成形微通道成形质量的交互影响。从微观组织和应力应变状态研究了Cu / Ni复合箔的形成特性。实验结果表明,当退火温度升高时,成形深度,不规则变形和表面粗糙度均增加。由于微通道特征尺寸(腔宽度)的减小,相对形成深度和表面粗糙度值减小,所定位的厚度变薄变得严重。成型零件的表面粗糙度与塑性变形程度,晶粒尺寸和微模具的表面质量有关。堆垛顺序对成形结果的影响与Cu / Ni复合箔的晶粒尺寸和特征尺寸有关。当Cu层位于外部时,可成形性通常更好。然而,当特征尺寸减小并且Ni层的晶粒尺寸细且均匀时,位于外部的Ni层的形成质量得到改善,甚至超过了其他。分析了双极板成形与微通道成形过程中应力应变状态的差异。优化了成形载荷,润滑方式和保持时间等参数,并通过优化后的参数制作了双极板并进行了评估。

著录项

  • 来源
    《Journal of Manufacturing Processes》 |2020年第5期|293-303|共11页
  • 作者

  • 作者单位

    Harbin Inst Technol Weihai Sch Mat Sci & Engn Weihai 264209 Peoples R China|Harbin Inst Technol Key Lab Microsyst & Microstruct Mfg Minist Educ Harbin 150080 Peoples R China;

    Harbin Inst Technol Key Lab Microsyst & Microstruct Mfg Minist Educ Harbin 150080 Peoples R China;

    Harbin Inst Technol Weihai Sch Mat Sci & Engn Weihai 264209 Peoples R China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Cu/Ni clad foil; Micro channel; Bipolar plate; Flexible micro forming; Formability;

    机译:铜/镍复合箔;微通道;双极板;灵活的微成型;可成型性;

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