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GaN-Based LEDs With Contact-Transferred and Mask-Embedded Lithography and In-Situ N$_{2}$ Treatments

机译:基于GaN的LED,采用接触转移和掩模嵌入式光刻技术并进行原位N $ _ {2} $处理

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摘要

The authors report that GaN-based LEDs with contact-transferred and mask-embedded lithography (CMEL) and in-situ N $_{2}$ treatments were fabricated. From the experiment results, it can be seen clearly that the characteristic of ITO contacts on the etched p-GaN with the N $_{2}$ treatment-20 sccm shows a near ohmic behavior. With 20 mA current injection, it was found that forward voltage and output power were 3.09 V and 5.16 mW for the LED with CMEL-400 nm-treatment. It was also found that we can achieve 20.5% enhancement for the LED with CMEL-400 nm and do not degrade the electrical properties of the GaN-based LEDs. Furthermore, the reliability of the proposed LED was good.
机译:作者报告说,已经制造了具有接触转移和掩模嵌入式光刻(CMEL)以及原位N $ {2} $处理的基于GaN的LED。从实验结果可以清楚地看出,经N $ _ {2} $处理的20sccm的蚀刻的p-GaN上的ITO接触的特性显示出接近欧姆的行为。通过注入20 mA电流,发现采用CMEL-400 nm处理的LED的正向电压和输出功率为3.09 V和5.16 mW。还发现,对于CMEL-400 nm的LED,我们可以实现20.5%的增强,并且不会降低GaN基LED的电性能。此外,所提出的LED的可靠性良好。

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