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机译:214-Gb / s 4-PAM倒装芯片互连EADFB激光模块的操作
NTT Device Innovation Center, NTT Corporation, Atsugi-shi, Japan;
NTT Device Technology Laboratories, NTT Corporation, Atsugi-shi, Japan;
NTT Device Innovation Center, NTT Corporation, Atsugi-shi, Japan;
NTT Device Innovation Center, NTT Corporation, Atsugi-shi, Japan;
NTT Device Technology Laboratories, NTT Corporation, Atsugi-shi, Japan;
NTT Device Innovation Center, NTT Corporation, Atsugi-shi, Japan;
NTT Device Technology Laboratories, NTT Corporation, Atsugi-shi, Japan;
NTT Device Innovation Center, NTT Corporation, Atsugi-shi, Japan;
Lasers; Bandwidth; Wires; Frequency response; Integrated circuit interconnections; Modulation; Optical transmitters;
机译:倒装芯片互连EADFB激光模块产生的100 Gb / s 4-PAM信号的无均衡器传输
机译:紧凑的倒装芯片互连8 x 50 Gbit / s EADFB激光阵列模块,用于400 Gbit / s收发器
机译:超过100 Gb / s(4×25.8 Gb / s)EADFB激光阵列发射器的倒装芯片互连技术
机译:倒装芯片互连集总电极EADFB激光模块的56 Gbaud 4-PAM(112-Gbit / s)操作用于无均衡器传输
机译:用于20 Gbit / sec 4-PAM背板串行I / O互连的均衡和近端串扰(NEXT)噪声消除。
机译:通过靶基因的逆激活共功能和高度互连来鉴定功能异常的miRNA-mRNA调控模块:胶质母细胞瘤的案例研究
机译:用于数据中心互连的32 Gbaud 4-pam的实验演示,最长可达320 km
机译:用于倒装芯片连接互连技术的聚合物/金属浆料的材料开发。季度报告