...
首页> 外文期刊>Journal of intelligent material systems and structures >Effects of added SiO_2 nanoparticles on the thermal expansion behavior of shape memory polymer nanocomposites
【24h】

Effects of added SiO_2 nanoparticles on the thermal expansion behavior of shape memory polymer nanocomposites

机译:SiO_2纳米颗粒的添加对形状记忆聚合物纳米复合材料热膨胀行为的影响

获取原文
获取原文并翻译 | 示例
           

摘要

In this study, a unit cell-based micromechanical approach is proposed to analyze the coefficient of thermal expansion of shape memory polymer nanocomposites containing SiO2 nanoparticles. The interphase region created due to the interaction between the SiO2 nanoparticles and shape memory polymer is modeled as the third phase in the nanocomposite representative volume element. The influences of the temperature, volume fraction, and diameter of the SiO2 nanoparticles on the thermal expansion behavior of shape memory polymer nanocomposite are explored. It is observed that the coefficient of thermal expansion of shape memory polymer nanocomposite decreases with the increase in the volume fraction up to 12%. Also, the results reveal that with the increase in temperature, the shape memory polymer nanocomposite coefficient of thermal expansion linearly increases. The role of interphase region on the thermal expansion response of the shape memory polymer nanocomposite is found to be very important. In the presence of interphase, the reduction in nanoparticle diameter leads to lower coefficient of thermal expansion for shape memory polymer nanocomposite, while the variation of nanoparticles diameter does not affect the coefficient of thermal expansion in the absence of interphase. Based on the simulation results, the shape memory polymer nanocomposite coefficient of thermal expansion decreases as the interphase thickness increases. In addition, the contribution of interphase coefficient of thermal expansion to the shape memory polymer nanocomposite coefficient of thermal expansion is more significant than that of interphase elastic modulus.
机译:在这项研究中,提出了一种基于晶胞的微机械方法来分析包含SiO2纳米颗粒的形状记忆聚合物纳米复合材料的热膨胀系数。由于SiO 2纳米颗粒和形状记忆聚合物之间的相互作用而产生的相间区域被建模为纳米复合代表体积元素中的第三相。探讨了SiO2纳米颗粒的温度,体积分数和直径对形状记忆聚合物纳米复合材料热膨胀行为的影响。观察到形状记忆聚合物纳米复合材料的热膨胀系数随着体积分数的增加而降低,直至12%。而且,结果表明,随着温度的升高,形状记忆聚合物纳米复合材料的热膨胀系数线性增加。发现相间区域对形状记忆聚合物纳米复合材料的热膨胀响应的作用非常重要。在存在中间相的情况下,纳米颗粒直径的减小导致形状记忆聚合物纳米复合材料的热膨胀系数降低,而在没有中间相的情况下,纳米颗粒直径的变化不影响热膨胀系数。基于仿真结果,形状记忆聚合物纳米复合材料的热膨胀系数随着相间厚度的增加而减小。此外,相间热膨胀系数对形状记忆聚合物纳米复合材料热膨胀系数的贡献比相间弹性模量的贡献更大。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号