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Computer simulation model development and validation for radio frequency (RF) heating of dry food materials

机译:干食品原料的射频(RF)加热的计算机仿真模型开发和验证

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摘要

Radio frequency (RF) heat treatment has been identified as a novel pasteurization and non-chemical quarantine method for dry food materials. But the major obstacle of this treatment is non-uniform heating in these food materials. The objective of this study was to help understand RF heating process by developing a computer simulation model. A finite element based commercial software FEMLAB was used to develop the computer model for a 12 kW, 27.12 MHz parallel plate RF system. Wheat flour was selected as a model food to represent dry food materials. Dielectric properties of wheat flour were measured using an open-ended coaxial probe connected with impedance analyzer, whereas thermal properties were determined using a duel needle probe method. Simulated and experimented temperature profiles (℃) of wheat flour were compared in four different horizontal layers after 3 min of RF heating, with a fixed electrode gap of 155 mm. Both, simulated and experimental results showed that temperature values were higher at the mid layers followed by top and bottom layers. Corners were more heated than centers in each layer. Sensitivity analysis showed that temperature uniformity in the sample was most affected by top electrode voltage and sample dielectric properties. The developed model can further be used to study the effect of some important parameters such as sample size, position, shape, and dielectric properties on RF heating of dry food materials.
机译:射频(RF)热处理已被认为是一种用于干燥食品原料的新型巴氏灭菌和非化学隔离方法。但是,这种处理的主要障碍是这些食品原料中的加热不均匀。这项研究的目的是通过建立计算机仿真模型来帮助理解RF加热过程。使用基于有限元的商业软件FEMLAB来开发12 kW,27.12 MHz平行板RF系统的计算机模型。选择小麦粉作为代表干粮原料的标准食品。小麦面粉的介电性能使用与阻抗分析仪连接的开放式同轴探针进行测量,而热性能则使用双针探针法进行测定。射频加热3分钟后,在155 mm的固定电极间隙下,在四个不同的水平层中比较了小麦粉的模拟和实验温度曲线(℃)。模拟和实验结果均表明,中间层,其次是顶层和底层的温度值较高。在每一层中,角落比中心要热得多。灵敏度分析表明,样品中的温度均匀性受顶部电极电压和样品介电性能的影响最大。所开发的模型可以进一步用于研究一些重要参数(例如样品大小,位置,形状和介电特性)对干食品原料的RF加热的影响。

著录项

  • 来源
    《Journal of food engineering》 |2011年第1期|p.48-55|共8页
  • 作者单位

    Department 0/Biological Systems Engineering, Washington State University, 213 LJ Smith Hall, Pullman, WA 99164-6120, USA;

    Department 0/Biological Systems Engineering, Washington State University, 213 LJ Smith Hall, Pullman, WA 99164-6120, USA;

    Department 0/Biological Systems Engineering, Washington State University, 213 LJ Smith Hall, Pullman, WA 99164-6120, USA;

    Department of Biological Systems Engineering, University of Nebraska, Lincoln, NE 68583, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    rf heat treatment; computer simulation; wheat flour; dielectric properties; heating uniformity;

    机译:射频热处理;计算机模拟;小麦粉;介电性能;加热均匀度;

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