Nihon Superior Makes Mark With Vast Product Lineup

摘要

Nihon Superior Co. Ltd., will make its presence felt at the forthcoming IPC APEX EXPO 2011, which will take place from April 12 to 14 at the Mandalay Bay Convention Center in Las Vegas, Nevada, in the United States. The company will highlight its advanced soldering materials at the show, including the halogen-free SN100C P602 D4, which has no added halogens fluorine, chlorine, bromine, or even iodine. The silver-free SN100C alloy delivers a stable microstructure in an alloy that can accommodate the long-term cyclic strains and impact loading to which a solder joint can be subjected. The SN100C fillets are smooth and bright with few shrinkage defects, and have a stable microstructure with minimal growth of the interfacial intermetallic for highly reliable solder joints. The SN100C P602 D4 provides excellent printing and reflow in fine-pitch circuitry, low hot and cold slump, and good coalescence and wetting with no solder balls.