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Solid-State Refrigeration Based on the Electrocaloric Effect for Electronics Cooling

机译:基于电热效应的固态制冷用于电子制冷

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摘要

Subambient temperature operations of advanced semiconductor devices offer many benefits, including improved reliability, reduced leakage currents, and enhanced signal to noise ratios. We discuss a new design concept for compact solid-state refrigerators based on the electrocaloric (EC) effect. The EC refrigerators are attractive because they may approach the Carnot efficiency more closely than Peltier coolers, which involve intrinsically irreversible processes. To address parasitic losses and other practical considerations that limit the actual performance of EC coolers, we incorporate laterally inter-digitated electrode arrays with high effective thermal conductivity and switchable thermal interfaces with high switching ratios and high off-state thermal resistance. Numerical simulations are used to quantify the impact of various design parameters and the expected performance of the module, focusing in particular on the heat diffusion time and RC thermal time constant. Based on the material properties reported in the literature, we project that cooling power densities >10 W/cm~2 may be achieved across △T of the order of 10 K at coefficient of performance (COP) > 10. The present work motivates further experimental studies to develop advanced electrocaloric materials and fabricate/ test cooling modules to assess the feasibility of their practical application.
机译:先进的半导体器件在低于室温的温度下工作可带来许多好处,包括改善的可靠性,减少的泄漏电流和增强的信噪比。我们讨论一种基于电热(EC)效应的紧凑型固态冰箱的新设计概念。 EC冰箱很有吸引力,因为它们可能比Peltier冷却器更接近卡诺效率,后者涉及本质上不可逆的过程。为了解决寄生损耗和其他限制EC冷却器实际性能的实际考虑,我们引入了横向交叉指型电极阵列,这些电极阵列具有很高的有效热导率和可切换的热界面,具有较高的开关率和较高的断态热阻。数值模拟用于量化各种设计参数和模块预期性能的影响,尤其是集中在热扩散时间和RC热时间常数上。根据文献中报道的材料特性,我们预计在性能系数(COP)> 10的情况下,跨10K数量级的△T可以实现> 10 W / cm〜2的冷却功率密度。开发先进的电热材料和制造/测试冷却模块的实验研究,以评估其实际应用的可行性。

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