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机译:通过测量电阻监测球栅阵列互连中的疲劳裂纹
Northwestern University, aterials Science and Engineering Department, 2220 Campus Drive, Evanston, IL 60208;
Northwestern University, aterials Science and Engineering Department, 2220 Campus Drive, Evanston, IL 60208;
Northwestern University, Mechanical Engineering Department, 2145 Sheridan Road, Evanston, IL 60208;
Northwestern University, Mechanical Engineering Department, 2145 Sheridan Road, Evanston, IL 60208;
lead-free solder; interconnects; fatigue; paris relation; electrical resistance; cracking;
机译:电流对具有Sn-Ag-Cu焊料互连的细间距球栅阵列封装的长期可靠性的影响
机译:焊盘下方层压板裂纹对球栅阵列焊点疲劳寿命的影响
机译:Sn-Ag-Cu球栅阵列封装的Sn-Zn-Bi添加在240℃下的电阻
机译:球栅阵列封装焊球接头热分析中的收缩阻力模型
机译:球栅阵列电子封装的互连几何形状和疲劳寿命研究。
机译:类似于球栅阵列的64针纳米线表面紧固件用于室温电连接
机译:直流电势法疲劳裂纹增长率的可靠性工程方法。 III。直流电势法,高强度钢HT60疲劳裂纹生长速率的可靠性工程方法。
机译:使用顺应性和电阻技术来表征疲劳裂纹闭合