机译:无助焊剂的银垫上无铅微焊料球的高频和低温热超声键合
State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha, HN Province 410083, China;
State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha, HN Province 410083, China;
State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha, HN Province 410083, China;
lead-free solder ball; thermosonic bonding; low temperature; bonding strength;
机译:金线与铜互连芯片的键合焊盘上的银键合层上的热超声键合
机译:铝金属焊盘上的热超声金球键合中的初始键形成
机译:通过沉积镍层提高金球热超声键合到挠性基板的键合能力和球剪切力
机译:基于电镀铜微凸块和凹垫的改进型热超声倒装芯片键合,用于高精度低温组装应用
机译:使用3.8%的锡0.07%的铜和免清洗的无VOC助焊剂的“厚” PCB的无铅波峰焊
机译:热超声球键合:键合机理和界面演化的研究