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HDPE Matrix Composites Filled With Ca_4La_6(SiO_4)_4(PO_4)_2O_2 for Microwave Substrate Applications

机译:填充Ca_4La_6(SiO_4)_4(PO_4)_2O_2的HDPE基复合材料,用于微波衬底

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摘要

Polymer-ceramic composites have been prepared by dispersing Ca_4La_6(SiO_4)_4(PO_4)_2O_2 (CLSP) ceramic filler in high density polyethylene (HDPE) matrix through melt mixing. Scanning electron micrographs reveal the extent of filler dispersion. The dielectric properties at 1 MHz and 5 GHz have been investigated as a function of filler content. The relative permittivity increases with filler loading, maintaining a low dielectric loss. The composite with highest filler loading of 0.4 volume fraction shows a relative permittivity of 5.1 and dielectric loss of 2.3 × 10~(-3) at 5 GHz. Experimentally observed values of relative permittivity at 5 GHz have been compared with the values calculated using various theoretical models. Both the coefficient of linear thermal expansion and tensile strength have been observed to decrease with filler loading, reaching a minimum value of 117 ppm/℃ and 20.7 MPa, respectively, at 0.4 volume fraction of filler. The composite with maximum filler loading of 0.4 volume fraction shows the highest thermal conductivity (TC) and is 1.2W m~(-1) K~(-1).
机译:通过熔融混合将Ca_4La_6(SiO_4)_4(PO_4)_2O_2(CLSP)陶瓷填料分散在高密度聚乙烯(HDPE)基质中来制备聚合物-陶瓷复合材料。扫描电子显微照片揭示了填料分散的程度。已经研究了在1 MHz和5 GHz下的介电性能随填料含量的变化。相对介电常数随填料填充量增加而保持低介电损耗。最高填充量为0.4体积分数的复合材料在5 GHz下的相对介电常数为5.1,介电损耗为2.3×10〜(-3)。将实验观察到的在5 GHz处的相对介电常数值与使用各种理论模型计算出的值进行了比较。线性热膨胀系数和拉伸强度都随着填料的加入而降低,在填料的体积分数为0.4时分别达到117 ppm /℃和20.7 MPa的最小值。最大填充量为0.4体积分数的复合材料具有最高的导热系数(TC),为1.2W m〜(-1)K〜(-1)。

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  • 来源
    《Journal of Electronic Packaging》 |2014年第3期|031002.1-031002.5|共5页
  • 作者单位

    Materials Science and Technology Division, National Institute for Interdisciplinary Science and Technology, CSIR, Trivandrum 695019, India Department of Physics, Government College, Kasaragod 671123, India;

    Materials Science and Technology Division, National Institute for Interdisciplinary Science and Technology, CSIR, Trivandrum 695019, India;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    dielectrics; microwave; wireless; composites;

    机译:电介质微波;无线;复合材料;

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