Multiphysics Analysis for Temperature Rise of Electronic Connectors Using a Multiscale Model

摘要

Temperature rise could be a crucial issue for some electronic connectors subjected to the relative large electrical current. A nonstatistical multiscale sinusoidal rough surface (MSRS) model is adopted to estimate the contact area between matched metallic terminals as a function of contact load. A fast Fourier transform (FFT) is conducted to characterize the measured surface topology of the terminals. Multiphysics three-dimensional (3D) finite element analysis (FEA) is then carried out to evaluate the temperature rise of mated micro-universal serial bus (USB) connectors. Temperature distributions of the terminal based on the numerical simulations are in good agreement with those based on the measurements using a thermal couple and an infrared thermal camera as well.