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Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads

机译:SN3.0AG0.5CU焊料合金组合循环剪切和恒定拉伸/压缩负载下的疲劳寿命

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摘要

Solder joints in electronic assemblies experience damage due to cyclic thermomechanical loading that eventually leads to fatigue fracture and electrical failure. While solder joints in smaller, die-sized area-array packages largely experience shear fatigue due to thermal expansion mismatch between the component and the substrate, larger area-array packages experience a combination of cyclic shear and axial tensile/compressive loads due to flexure of the substrate. Additionally, on larger processor packages, the attachment of heatsinks further exacerbates the imposed axial loads, as does package warpage. With the increase in size of packages due to 2.5D heterogeneous integration, the above additional axial loads can be significant. Thus, there exists a critical need to understand the impact on fatigue life of solder joints with superposed compressive/tensile loads on the cyclic shear loads. In this paper, we describe a carefully constructed multi-axial micro-precision mechanical tester as well as fatigue test results on Sn3.0Ag0.5Cu (SAC305) solder joints subjected to controlled cyclic shear and constant compressive/tensile loads. The tester design allows one to apply cyclic shear loads up to 200 N while maintaining a constant axial load of up to 38 N in tension or compression. The tester is capable of maintaining the axial load to within a tolerance of ±0.5 N during the entirety of fatigue experiment. Carefully constructed test specimens of Sn3.0Ag0.5Cu solder joints were iso-thermally fatigued under systematically increased compressive and tensile loads imposed on the test specimen subject to repeated loading (R = 0) under lap-shear. In general, the imposition of the superposed compressive load increases the fatigue life of the solder joint compared to application of pure cyclic shear, while the imposition of the superposed tensile load decreases the fatigue life. At larger compressive loads, friction between fractured surfaces is responsible for significant energy dissipation during the cyclic load-unload cycles.
机译:电子组件中的焊点由于循环热机械负载而经历损坏,最终导致疲劳骨折和电气故障。虽然在较小的模尺寸的区域阵列包装中的焊点在很大程度上经历由于部件和基板之间的热膨胀不匹配而在很大程度上经历剪切疲劳,但由于弯曲而较大的区域阵列包装经历循环剪切和轴向拉伸/压缩载荷的组合基材。另外,在较大的处理器包装上,散热器的附接进一步加剧了施加的轴向载荷,如套装翘曲。随着由于2.5D异构整合的包装尺寸的增加,上述额外的轴向载荷可能是显着的。因此,存在危急需要了解对循环剪切载荷上的叠加压缩/拉伸载荷的焊接接头的疲劳寿命的影响。在本文中,我们描述了一个精心构建的多轴微精密机械测试仪,以及对受控循环剪切和恒定压缩/拉伸载荷进行控制的SN3.0AG0.5CU(SAC305)焊点的疲劳试验结果。测试仪设计允许液体剪切载荷施加高达200n,同时保持高达38n的恒定或压缩的恒定轴向载荷。测试仪能够在整个疲劳实验期间将轴向载荷保持在±0.5n的公差范围内。精心构造的SN3.0AG0.5CU焊点的试验标本在系统增加的压缩和拉伸载体上被施加在试样上施加在圈子剪切下的重复加载(r = 0)。通常,与纯环剪切的施加相比,叠加叠加压缩负荷的施加增加了焊点的疲劳寿命,而叠加的拉伸载荷的施加降低了疲劳寿命。在较大的压缩载荷下,裂缝表面之间的摩擦负责在循环负载卸载循环期间的显着能量耗散。

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  • 来源
    《Journal of Electronic Packaging》 |2020年第4期|041001.1-041001.11|共11页
  • 作者单位

    School of Mechanical Engineering Purdue University West Lafayette IN 4790;

    School of Mechanical Engineering Purdue University West Lafayette IN 47907;

    School of Mechanical Engineering Purdue University West Lafayette IN 47907;

    School of Mechanical Engineering Purdue University West Lafayette IN 47907;

    School of Materials Engineering Purdue University West Lafayette IN 47907;

    Juniper Networks Sunnyvale CA 94089;

    Juniper Networks Sunnyvale CA 94089;

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  • 正文语种 eng
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