Role of Line-Beam on the Removal of Particulate Contaminations from Solid Surfaces by Pulsed Laser

摘要

In this paper, we have examined the particulate removal efficiency of a laser from solid surfaces. The silicon wafers were contaminated with 0.05 to 0.5 μm sized alumina particles. The silicon wafers with uniform surface-distribution of alumina particles were subjected to pulsed laser beams at varying conditions. The results obtained have shown that line beam lasers can remove submicron particles more efficiently from solid surfaces. The mechanism responsible for higher particulate removal-efficiency of line beam laser has also been discussed.