Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays Erratum to Volume 38, Number 11, November 2009, pp. 2308–2313

Albert T. Wu; Chun-Yang Tsai; Chin-Li Kao; Meng-Kai Shih; Yi-Shao Lai; Hsin-Yi Lee; Ching-Shun Ku

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Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays Erratum to Volume 38, Number 11, November 2009, pp. 2308–2313

机译：勘误至：利用同步辐射X射线对倒装芯片硅模具中应变的热和电效应进行原位测量勘误至第38卷，第11期，2009年11月，第2308-2313页

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来源
《Journal of Electronic Materials》 |2009年第12期|p.1-1|共1页
作者
Albert T. Wu; Chun-Yang Tsai; Chin-Li Kao; Meng-Kai Shih; Yi-Shao Lai; Hsin-Yi Lee; Ching-Shun Ku;
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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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正文语种 eng
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1. In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays [J] . ALBERT T. WU, CHUN-YANG TSAI, CHIN-LI KAO, Journal of Electronic Materials . 2009,第11期

机译：使用同步辐射X射线原位测量倒装芯片硅片中应变的热和电效应
2. In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays [J] . Albert T. Wu, Chun-Yang Tsai, Chin-Li Kao, Journal of Electronic Materials . 2009,第11期

机译：使用同步辐射X射线原位测量倒装芯片硅模中应变的热和电效应
3. Erratum: On the calculation of the gauge volume size for energy-dispersive X-ray diffraction (Journal of Synchrotron Radiation (2011) 18 (938-941)) [J] . Rowles M.R. Journal of synchrotron radiation . 2012,第1期

机译：勘误表：关于能量色散X射线衍射的标称体积尺寸的计算（同步辐射学报（2011）18（938-941））
4. In-Situ Strain Measurements of EB-PVD Thermal Barrier Coatings using Synchrotron X-Ray Diffraction under Thermo-Mechanical Loading [C] . Rene Diaz, Mitra Mossaddad, Anil Bozan, AIAA aerospace sciences meeting including the new horizons forum and aerospace exposition . 2011

机译：在热机械载荷下使用同步加速器X射线衍射对EB-PVD热障涂层进行原位应变测量
5. Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays [O] . Albert T. Wu, Chun-Yang Tsai, Chin-Li Kao, 2009

机译：错误的：在使用同步辐射X射线的倒装芯片硅模具中的应变热量和电气效应的原位测量

Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays Erratum to Volume 38, Number 11, November 2009, pp. 2308–2313

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