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首页> 外文期刊>Journal of Electronic Materials >Nonvolatile Metal–Oxide–Semiconductor Capacitors with Ru-RuOx Composite Nanodots Embedded in Atomic-Layer-Deposited Al2O3 Films
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Nonvolatile Metal–Oxide–Semiconductor Capacitors with Ru-RuOx Composite Nanodots Embedded in Atomic-Layer-Deposited Al2O3 Films

机译:原子沉积Al 2 O 3 薄膜中嵌入Ru-RuO x 复合纳米点的非易失性金属-氧化物-半导体电容器

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摘要

Growth of Ru-RuO x composite nanodots (RONs) on atomic-layer-deposited Al2O3 films has been investigated using magnetic sputtering of a Ru target followed by postdeposition annealing. RONs with a density as high as ~2 × 1012 cm−2 were obtained together with good uniformity. Subsequently, metal–oxide–semiconductor capacitors with RONs embedded in Al2O3 films have been electrically characterized for different configurations of tunneling layers (T)/blocking layers (B), and the underlying mechanisms of charge storage are discussed. For a 6-nm T/22-nm B device, a memory window of 3.7 V is achieved for a ±7 V programing/erasing voltage for 0.1 ms, and superior charge retention of more than 80% is achieved after 10 years.
机译:研究了Ru-RuO x 复合纳米点(RONs)在原子层沉积的Al 2 O 3 膜上的生长。 Ru靶,然后进行后退火。获得密度高达〜2×10 12 cm -2 的RON。随后,已经对具有不同结构的隧穿层(T)/阻挡层(B)的电特性进行了表征,这些金属氧化物半导体电容器的RON嵌入Al 2 O 3 膜中,并讨论了电荷存储的基本机制。对于6纳米T / 22纳米B器件,±7 V编程/擦除电压可实现3.7 V的存储窗口,持续时间为0.1毫秒,经过10年后可实现80%以上的优异电荷保持率。

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