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Impact Of Cbr_4, V/iii Ratio, Temperature And Ash_3 Concentration On Movpe Growth Of Gaassb:c

机译:Cbr_4,V / iii比,温度和Ash_3浓度对Gaassb:c Movpe生长的影响

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We investigate the impact of the carbon tetrabromine (CBr_4) and arsine (AsH_3) concentrations, the V/III ratio at the gas inlet (R_(inlet)) and the temperature (T_g) on the growth rate, the solid composition, the incorporated carbon (C) and free hole concentration in GaAsSb:C grown by metal-organic vapor-phase epitaxy (MOVPE). The introduction of CBr_4 deeply perturbs the growth when compared to when no C-doping is used. The growth of GaAsSb:C using CBr_4 behaves as if an effective V/III ratio (R_(eff)) were defined as the R_(inter) leading to the same growth rate in the absence of CBr_4 under the same group V inlet flux. This consideration allows (and/or accounts) for the growth of high-quality layers with R_(inlet)≤1, and explains alloy composition and growth rate variations as well as non-monotonic variations of the free hole concentration with increasing CBr_4 flow. We show how Reff~1 can be experimentally determined to optimize the growth conditions in MOVPE reactors. An increase of the CBr_4 flux enhances the solid arsenic (As) concentration and reduces the growth rate. The As concentration dependence on the CBr_4 flux becomes stronger at higher R_inlet. Although the incorporated C density monotonically increases with increasing CBr_4 flow, the hole concentration increases and then drops. This drop is attributed to the amphoteric character of C and/or to the formation of C-C bonds. The peak hole density is enhanced from 2.5×10~(19) to over 1.6×10~(20)cm~(-3) by reducing Rinlet from 0.72 to 0.25. Furthermore, the hole density decreases from 1.6×10~(20) to 5.5×10~(19)cm~3 if the AsH_3 concentration increases from 0.31 to 0.51. Thus, alloys with As-rich composition obtained by increasing the AsH_3 composition in the gas phase cannot achieve hole concentrations as high as 1×l0~(20)cm~(-3) at Tg=550℃. However, we demonstrate that GaAs_(0.7)Sb_(0.3) with doping levels of 1×10~(2O)cm~(-3) could only be achieved by decreasing T_g to 510℃.
机译:我们研究了四溴化碳(CBr_4)和砷化氢(AsH_3)浓度,气体入口处的V / III比(R_(入口))和温度(T_g)对生长速率,固体成分,所含杂质的影响。金属有机气相外延(MOVPE)生长的GaAsSb:C中的碳(C)和自由空穴浓度。与不使用C掺杂的情况相比,CBr_4的引入极大地干扰了生长。使用CBr_4的GaAsSb:C的生长就像将有效的V / III比(R_(eff))定义为在相同的V组入口通量下不存在CBr_4的情况下导致相同的生长速率的R_(inter)。这种考虑允许(和/或考虑)R_(入口)≤1的高质量层的生长,并解释了随着CBr_4流量的增加,合金成分和生长速率变化以及自由孔浓度的非单调变化。我们展示了如何通过实验确定Reff〜1以优化MOVPE反应器的生长条件。 CBr_4通量的增加会提高固体砷(As)的浓度并降低生长速率。 R_inlet越高,对CBr_4通量的As浓度依赖性越强。尽管结合的C密度随CBr_4流量的增加而单调增加,但空穴浓度先增加后降低。该下降归因于C的两性特征和/或C-C键的形成。通过将Rinlet从0.72降低到0.25,可将峰值空穴密度从2.5×10〜(19)提高到1.6×10〜(20)cm〜(-3)以上。此外,如果AsH_3的浓度从0.31增加到0.51,则空穴密度从1.6×10〜(20)降低到5.5×10〜(19)cm〜3。因此,通过在气相中增加AsH_3组成而获得的富As组成的合金在Tg = 550℃下不能实现高达1×10〜(20)cm〜(-3)的空穴浓度。然而,我们证明,只有将T_g降低到510℃才能实现掺杂水平为1×10〜(2O)cm〜(-3)的GaAs_(0.7)Sb_(0.3)。

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