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Effect of annealing on the microstructure of Ni_(80)Fe_(20)/Cu multilayers

机译:退火对Ni_(80)Fe_(20)/ Cu多层膜显微组织的影响

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[Ni_(80)Fe_(20)/Cu]_(15) multilayers grown by DC-magnetron sputtering and annealed at different temperatures and/or times were investigated by low- and high-angle X-ray diffraction. Structural parameters such as superlattice period, interplane distance, average multilayer coherence length and interfacial roughness were obtained. It was found that as the annealing temperature increases the superlattice period, interplane distance, average multilayer coherence length decrease, while (111) preferred orientation of the superlattices was improved slightly. The interfacial roughness increases with increasing annealing temperature and/or time. A significant intermixing layer located in the interlayer region between the Ni_(80)Fe_(20) and Cu layers was revealed by simulating the high-angle X-ray diffraction profiles. The thickness of the intermixing layer increases as the annealing temperature or annealing time increases.
机译:通过低角度和高角度X射线衍射研究了通过DC磁控溅射生长并在不同温度和/或时间退火的[Ni_(80)Fe_(20)/ Cu] _(15)多层膜。获得了诸如超晶格周期,平面间距,平均多层相干长度和界面粗糙度等结构参数。结果发现,随着退火温度的增加,超晶格的周期,晶面间距,多层平均相干长度减小,而(111)超晶格的择优取向有所改善。界面粗糙度随着退火温度和/或时间的增加而增加。通过模拟高角度X射线衍射图可以发现位于Ni_(80)Fe_(20)和Cu层之间的中间区域中的重要混合层。混合层的厚度随着退火温度或退火时间的增加而增加。

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