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首页> 外文期刊>Journal of Crystal Growth >Characterization of defects in annealed Czochralski-grown silicon wafers by photoluminescence method
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Characterization of defects in annealed Czochralski-grown silicon wafers by photoluminescence method

机译:通过光致发光法表征退火的切克劳斯基生长的硅晶片中的缺陷

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Defect-related deep-level traps in two-step annealed Czochralski-grown silicon (Cz-Si) wafers are examined by the photoluminescence (PL) method. As interstitial oxygen reduction increases after the annealing, the deep-level emissions labeled by the D1 and D2 lines become stronger in the PL spectra at 4.2 K. The band-edge PL intensity at room temperature decreases with an increase in the D-line emission. The decay-time curve of the band-edge emission is successfully measured under the same excitation condition as the band-edge PL intensity measurement using an instrument we developed. Using this decay-time curve method, the band-edge PL intensity is correlated to the carrier lifetime for the two-step annealed Cz-Si wafers.
机译:通过光致发光(PL)方法检查了两步退火的切克劳斯基生长的硅(Cz-Si)晶片中与缺陷相关的深层陷阱。随着退火后间隙氧减少的增加,D1和D2线标记的深层发射在4.2 K的PL光谱中变得更强。室温下的带边PL强度随着D线发射的增加而降低。使用我们开发的仪器,在与带边缘PL强度测量相同的激励条件下,成功测量了带边缘发射的衰减时间曲线。使用这种衰减时间曲线方法,将带边缘PL强度与两步退火Cz-Si晶片的载流子寿命相关联。

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