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Examining regeneration technologies for etching solutions: a critical analysis of the characteristics and potentials

机译:检查蚀刻溶液的再生技术:对特性和潜力的严格分析

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摘要

Globally, more than one billion cubic meters of waste etchants from printed circuit board industry have been generated annually with an increase of 15-18%. Nowadays, the approach of adding extra chemicals has been utilized to treat a large number of waste etchants, which could obtain low-pure products, but seriously pollute the environment. Furthermore, the processing enterprise cannot gain so much value that is affecting sustainable development. In the previous studies, the regeneration technologies of etching solution have not been studied comprehensively and systematically, so it is of extreme necessity to examine and choose the suitable technology towards a closed-loop supply chain. The results showed that previous etching solution (e.g. ammonium persulfate, sulfur/chromic acid, sulfuric acid/hydrogen peroxide, sodium chloride, ferric chloride) caused severe pollution without proper disposal, but most of the current etchants (e.g. cupric chloride, alkaline etching solution) can be renewable after substantially recycling heavy metals from the etchants. Regarding the latest emerging solution, the used oxidant such as chlorine is regarded as the major risk sources even if it has extraordinary etching ability. The current etching solutions could meet the goal of sustainable development of resources and the environment. For the copper chloride etching solutions that are now widely applied, there are various regeneration approaches, but only two are more favorable than the others. Among all the regeneration technologies, the electrolytic process and membrane technology not only get more pure products, but the residue solution can be renewable. Finally, we employed the analytic hierarchy process to compare the regeneration techniques and found that the electrolytic method and membrane technology are superior to other methods in the economic and environmental performance. The two methods can replace the chemical precipitation, which will sustain the printed circuit board industry. (C) 2015 Elsevier Ltd. All rights reserved.
机译:在全球范围内,每年印刷电路板行业产生的废蚀刻剂超过十亿立方米,增长了15%至18%。如今,添加多余化学物质的方法已被用于处理大量的废蚀刻剂,这些废蚀刻剂可以获得低纯度的产品,但会严重污染环境。此外,加工企业无法获得太多影响可持续发展的价值。在以前的研究中,没有对腐蚀液的再生技术进行过全面,系统的研究,因此有必要对闭环供应链进行研究并选择合适的技术。结果表明,先前的蚀刻溶液(例如过硫酸铵,硫/铬酸,硫酸/过氧化氢,氯化钠,氯化铁)会造成严重污染,而没有适当处置,但是目前大多数蚀刻剂(例如氯化铜,碱性蚀刻溶液) )在从蚀刻剂中大量回收重金属后可以再生。对于最新出现的解决方案,使用过的氧化剂(例如氯)即使具有出色的蚀刻能力,也被视为主要的风险来源。当前的蚀刻解决方案可以满足资源和环境的可持续发展的目标。对于现在广泛使用的氯化铜蚀刻液,有多种再生方法,但只有两种比其他方法更有利。在所有再生技术中,电解工艺和膜技术不仅可以得到更多的纯净产品,而且残留溶液可以再生。最后,我们采用层次分析法对再生技术进行了比较,发现电解法和膜技术在经济和环境性能方面均优于其他方法。两种方法可以代替化学沉淀,这将支撑印刷电路板行业。 (C)2015 Elsevier Ltd.保留所有权利。

著录项

  • 来源
    《Journal of Cleaner Production》 |2016年第1期|973-980|共8页
  • 作者单位

    Tsinghua Univ, Sch Environm, State Key Joint Lab Environm Simulat & Pollut Con, Beijing 100084, Peoples R China;

    Tsinghua Univ, Sch Environm, State Key Joint Lab Environm Simulat & Pollut Con, Beijing 100084, Peoples R China;

    Tsinghua Univ, Sch Environm, State Key Joint Lab Environm Simulat & Pollut Con, Beijing 100084, Peoples R China;

    Tsinghua Univ, Sch Environm, State Key Joint Lab Environm Simulat & Pollut Con, Beijing 100084, Peoples R China;

    Tsinghua Univ, Sch Environm, State Key Joint Lab Environm Simulat & Pollut Con, Beijing 100084, Peoples R China;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Printed circuit boards; Etching solution; Regeneration technology; Potential; Comparison;

    机译:印刷电路板;蚀刻解决方案;再生技术;电势;比较;

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