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No-Clean Process for Reflow Soldering Meets Environmental, Efficiency Needs

机译:免清洗回流焊工艺可满足环境和效率需求

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摘要

At the end of 1995, manufacturers around the world will complete the first phase of efforts to eliminate chlorofluorcarbons (CFCs) from production activities. Some studies have linked CFCs to damage in the earth's ozone layer. Makers are halting use of these products as an environmental protection measure. Elimination of CFCs has led many manufacturers to adopt washing-free processes. Manufacturers have a choice of several heating methods for reflow soldering. With all these methods, nitrogen (N2) atmospheres contribute substantially to washing-free production.
机译:1995年底,世界各地的制造商将完成第一阶段的工作,以消除生产活动中的氯氟烃(CFC)。一些研究将氟氯化碳与地球臭氧层的破坏联系在一起。制造商正在停止将这些产品用作环境保护措施。消除CFC导致许多制造商采用免洗工艺。制造商可以选择几种加热方法来进行回流焊接。通过所有这些方法,氮气(N2)气氛在很大程度上有助于免洗生产。

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