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Influence of Size Effect on Low‐Temperature Electrical Resistivity

机译:尺寸效应对低温电阻率的影响

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摘要

The low‐temperature electrical resistivity in thin plates has been theoretically examined. It is shown that the bulk relaxation time τi is a reasonable approximation to describe the impurity scattering. In constrast, the low‐temperature phonon‐electron interaction is not properly described by the bulk thermal relaxation time τp. Nevertheless, expressions have been obtained for the Fermi function in thin plates correct to first order in τi/τp≪1. The predicted temperature‐dependent resistivity obtained is smaller than the results predicted by Fuchs, which are also given explicitly in this limit for the first time. In the limit of very low temperatures and very thin plates a temperature dependence of resistivity greater than the bulk value, but ⅔ that obtained by Fuchs, is predicted. These results are discussed.
机译:理论上已经检查了薄板中的低温电阻率。结果表明,体积弛豫时间τi是描述杂质散射的合理近似值。相反,整体热弛豫时间τp不能正确描述低温声子-电子相互作用。然而,已经获得了在薄板中费米函数的表达式,该表达式在τi/ τp≪1中校正为一阶。所获得的与温度有关的预测电阻率小于Fuchs的预测结果,Fuchs也首次在此极限中明确给出了结果。在非常低的温度和非常薄的板的极限下,电阻率的温度依赖性大于体积值,但可预测到Fuchs获得的dependence。讨论了这些结果。

著录项

  • 来源
    《Journal of Applied Physics》 |1971年第7期|共6页
  • 作者

    Ehrlich Alexander C.;

  • 作者单位

    Naval Research Laboratory, Washington, D. C. 20390;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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